Coupled Thermal/Diffusion/Elasticity Modeling 5/4/12

[Coffer_001]

Hi

I can understand how to model moisture expansion (analogous to thermal expansion) by using the Heat Solver for diffusion and Heat Expansion Coefficient for the coefficient of moisture expansion (CME) feeding into the Linear Elasticity solver for modeling a hygrothermal solid.

I don't understand how a coupled thermal+diffusion+elasticity solution of a solid can be accomplished within the current (excellent) framework. I see a conflict with using the thermal solver and the diffusion solver interfering with each other when they each modify the Heat Expansion Coefficient.

Would someone please share their approach for simulating this problem using Elmer?

thanks

gsw