Re: Using multiple softwares for performing a simulation
Posted: 01 Dec 2016, 11:58
XFEM and Computational Homogenization for composite materias
1. Dissertation by Erik Svenning (2015)
2. https://www.chalmers.se/sv/personal/doc ... E_2015.pdf
3. Multiscale characterization of short-fiber reinforced composite
4. Homogenization theory and voronoi cell fem
Computational Magnetohemodynamics (Project references for Coupling Elmer and OpenFOAM)
1. Simulations of Magnetohemodynamics in Stenosed Arteries in Diabetic or Anemic Models, 2016 (ANSYS-Fluent)
2. Computational Modelling of Blood Flow Development and Its Characteristics in Magnetic Environment, 2013 (Comsol)
Grooving effects on grain boundary and FEM
1. imechanica literature
2. Ag-Cu system
3. Surface texture evaluation in Ag(Cu) and Ag systems
4. kinetics of grain boundary diffusion by Mullins (1959)
5. Numerical simulation of grooving effect via level set method
6. Young's modulus of Cu6Sn5 and thermal grooving(X.Deng et al,2004)
7. Thermal grooving by X.Deng et al (2004)
8. Scallop formation and dissolution of Cu6Sn5 IMC (D. Ma et al, 2002)
9. The role of thermal grooving, electrotransport and thermotransport in failure of electronic device (Hummel1984)
10. Templated Dewetting (Altomare, 2016)
11. Wetting and spreading in Ag-Cu system (Sharps et al in Acta Metallurgica, 1981)
1. Dissertation by Erik Svenning (2015)
2. https://www.chalmers.se/sv/personal/doc ... E_2015.pdf
3. Multiscale characterization of short-fiber reinforced composite
4. Homogenization theory and voronoi cell fem
Computational Magnetohemodynamics (Project references for Coupling Elmer and OpenFOAM)
1. Simulations of Magnetohemodynamics in Stenosed Arteries in Diabetic or Anemic Models, 2016 (ANSYS-Fluent)
2. Computational Modelling of Blood Flow Development and Its Characteristics in Magnetic Environment, 2013 (Comsol)
Grooving effects on grain boundary and FEM
1. imechanica literature
2. Ag-Cu system
3. Surface texture evaluation in Ag(Cu) and Ag systems
4. kinetics of grain boundary diffusion by Mullins (1959)
5. Numerical simulation of grooving effect via level set method
6. Young's modulus of Cu6Sn5 and thermal grooving(X.Deng et al,2004)
7. Thermal grooving by X.Deng et al (2004)
8. Scallop formation and dissolution of Cu6Sn5 IMC (D. Ma et al, 2002)
9. The role of thermal grooving, electrotransport and thermotransport in failure of electronic device (Hummel1984)
10. Templated Dewetting (Altomare, 2016)
11. Wetting and spreading in Ag-Cu system (Sharps et al in Acta Metallurgica, 1981)